Lead-Free Implementation and Production–A Manufacturing Guide
نویسندگان
چکیده
منابع مشابه
Challenges in Manufacturing Reliable Lead Free Components
The recent push for lead free products is resulting in significant changes in packaging materials. Manufacturers of electronic equipment are requiring materials that consistently withstand peak reflow temperatures of 240?C to 260°C. Reflow soldering at these ext reme temperatures, especially after extended moisture exposure, introduces several challenges that must be solved to produce reliable ...
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The push for lead-free or RoHS-compliant products is resulting in significant changes in packaging materials. Manufacturers of electronic equipment require materials that consistently withstand peak reflow temperatures of 240°C to 260°C. Reflow soldering at these extreme temperatures, especially after extended moisture exposure, introduces several challenges that must be solved to produce relia...
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As the electronics industry begins to focus upon the tin-silver-copper family of alloys as a viable replacement for tin-lead solders, research needs to be done to determine if any particular alloy is best suited for the broadest range of applications. The tin-silver-copper family of alloys has earned a great deal of positive response from various industry consortia and organizations in recent y...
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ژورنال
عنوان ژورنال: Journal of Electronic Packaging
سال: 2007
ISSN: 1043-7398,1528-9044
DOI: 10.1115/1.2429719